Q. In an integrated circuit, what does the term 'die' refer to?
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A.
The entire circuit board
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B.
The individual chip of silicon
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C.
The packaging of the IC
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D.
The power supply
Solution
A 'die' refers to the individual piece of silicon that contains the integrated circuit.
Correct Answer:
B
— The individual chip of silicon
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Q. In which type of integrated circuit are both analog and digital functions combined?
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A.
Digital IC
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B.
Analog IC
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C.
Mixed-signal IC
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D.
Power IC
Solution
Mixed-signal ICs combine both analog and digital functions, allowing for versatile applications.
Correct Answer:
C
— Mixed-signal IC
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Q. What does CMOS stand for in integrated circuit technology?
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A.
Complementary Metal-Oxide-Semiconductor
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B.
Common Metal-Oxide-Semiconductor
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C.
Complex Metal-Oxide-Semiconductor
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D.
Composite Metal-Oxide-Semiconductor
Solution
CMOS stands for Complementary Metal-Oxide-Semiconductor, a technology used for constructing integrated circuits.
Correct Answer:
A
— Complementary Metal-Oxide-Semiconductor
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Q. What does the term 'fabrication' refer to in the context of integrated circuits?
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A.
The design process
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B.
The manufacturing process
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C.
The testing process
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D.
The packaging process
Solution
Fabrication refers to the manufacturing process of creating integrated circuits on semiconductor wafers.
Correct Answer:
B
— The manufacturing process
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Q. What does the term 'scaling' refer to in integrated circuit technology?
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A.
Increasing the number of components
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B.
Decreasing the size of components
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C.
Improving power efficiency
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D.
Enhancing signal speed
Solution
Scaling refers to the process of decreasing the size of components in integrated circuits, allowing for more transistors to fit on a chip.
Correct Answer:
B
— Decreasing the size of components
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Q. What is the main advantage of using integrated circuits over discrete components?
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A.
Higher power consumption
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B.
Larger size
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C.
Lower cost and increased reliability
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D.
More complex design
Solution
Integrated circuits offer lower cost and increased reliability due to their compact size and reduced number of interconnections.
Correct Answer:
C
— Lower cost and increased reliability
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Q. What is the primary disadvantage of bipolar junction transistors (BJTs) compared to MOSFETs in integrated circuits?
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A.
Higher power consumption
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B.
Lower switching speed
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C.
More complex fabrication
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D.
Larger size
Solution
BJTs generally consume more power than MOSFETs, making them less favorable for low-power applications in integrated circuits.
Correct Answer:
A
— Higher power consumption
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Q. What is the primary function of a transistor in an integrated circuit?
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A.
To store data
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B.
To amplify signals
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C.
To provide power
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D.
To connect components
Solution
Transistors are used in integrated circuits primarily to amplify signals, acting as switches or signal modulators.
Correct Answer:
B
— To amplify signals
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Q. What is the purpose of a die in integrated circuits?
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A.
To package the IC
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B.
To serve as a substrate
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C.
To house the transistors
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D.
To connect to external circuits
Solution
A die is the small block of semiconducting material on which a functional circuit is fabricated, housing the transistors.
Correct Answer:
C
— To house the transistors
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Q. What is the purpose of doping in semiconductor fabrication?
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A.
To increase the size of the chip
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B.
To enhance electrical conductivity
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C.
To reduce power consumption
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D.
To improve thermal conductivity
Solution
Doping is used to enhance the electrical conductivity of semiconductors by adding impurities.
Correct Answer:
B
— To enhance electrical conductivity
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Q. What is the role of a capacitor in an integrated circuit?
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A.
To amplify signals
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B.
To store electrical energy
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C.
To provide a path for current
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D.
To regulate voltage
Solution
Capacitors in integrated circuits are used to store electrical energy temporarily, smoothing out voltage fluctuations.
Correct Answer:
B
— To store electrical energy
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Q. Which of the following is a common material used for the substrate in integrated circuits?
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A.
Silicon
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B.
Gallium arsenide
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C.
Germanium
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D.
All of the above
Solution
Silicon, gallium arsenide, and germanium are all common materials used as substrates in integrated circuits.
Correct Answer:
D
— All of the above
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Q. Which technology is commonly used for fabricating integrated circuits?
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A.
Thermal oxidation
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B.
Photolithography
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C.
Chemical etching
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D.
All of the above
Solution
All of the mentioned technologies are used in the fabrication of integrated circuits, particularly in the manufacturing process.
Correct Answer:
D
— All of the above
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